We figure as the main institute in the development in the area of semiconductors, acting in the fronts of integrated circuits (chips) and Packaging projects.
It has a team of professionals trained in state-of-the-art technologies, who develop high-tech and complex projects, both in the conception, simulation, design, verification and physical implementation in Silicon. Using tools such as: Cadence, Synopsys, Mentor Graphics and ANSYS, thus being able to guarantee a consolidated project flow and validated by the semiconductor industry.
Through the Advanced Packaging Laboratory, we carry out the production of small volumes of packaging of integrated and photonic circuits, going through all phases of the process: from the preparation of the wafer, welding, molding to the stage of electrical and functional tests of the physical devices.
As references of works carried out in the chip area, we have: DTV-ISDBt Digital TV demodulator chip (65 nanometers), EPC Global-915MHz RFID chip (180 nanometers), Pacemaker chip (180 nanometers), 24-bit ADC chip (180 nanometers) , DSP chip for high speed communication in 28, 14 and 7 (nanometers) and IEEE 802.15 Chip Transceiver. 4.G 65 (nanometers).
The packaging front has already been built: MCM (Multi Chip Module) modules to integrate solutions in Digital TV and Pacemaker, SiP (System in Package) of memory modules and high-speed photonic modules.
